產(chǎn)品規(guī)格書/Specification
產(chǎn)品/product: |
包封漿料/ package paste |
料號(hào)/part number: |
|
適用范圍/Application:
該款漿料適合于電路、電阻片外封標(biāo)識(shí),外層包封,可用于玻璃、陶瓷、不銹鋼、鋁合金等基材
The paste is suitable for marking thick film circuit and outside package, glass, ceramic, metal, etc.
使用條件/Operating conditions:
基材 Substrate |
厚膜電路、玻璃、陶瓷、金屬等 thick film circuit, glass, ceramic, metal, etc. |
使用方法 Method of use |
印刷,200-250目 Printing, 200-250mesh |
流平 Levelling |
5-10min minutes at room temperature 室溫下流平5-10分鐘(時(shí)間根據(jù)流平的實(shí)際情況決定)。 |
固化 Curing conditions |
通風(fēng)烘箱烘烤150~200℃,20-30分鐘 (固化溫度可以在150 150~ ( It could be cured at a temperature between 150~ |
稀釋劑 Thinner |
ST-1001 |
性能/Characteristics:
1. 漿料性能/Paste Characteristics:
性能Characteristic |
標(biāo)準(zhǔn)Standard |
測試方法及條件 Test method and conditions |
|
1 |
細(xì)度 Fineness |
≤8μm |
FOG test |
2 |
粘度Viscosity |
80~150Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25± Brookfield HBT(博利飛)粘度計(jì), 轉(zhuǎn)子SC4-14/6R), 10rpm, 25± |
3 |
Appearance 外觀 |
白色,黑色,藍(lán)色,綠色 white, black,blue, green |
|
2. 燒結(jié)后特性/Characteristics after curing:
在1燒結(jié)條件下,Check fired film produced under the conditions specified in 1),
特性 Characteristics |
Standard 標(biāo)準(zhǔn) |
測試方法和條件 Test method and conditions |
|
4 |
Acid resistance 耐酸性 |
Fine 良好 |
Marinate in 5% H2S04, 30mins, no difference with standard sample 5%硫酸,30分鐘無變化 |
5 |
Insulation resistance 絕緣系數(shù) |
---- |
RCJ-30 |
6 |
Breakdown voltage 擊穿電壓 |
---- |
CS |
保存條件,有效期/Storage condition and Term of validity
產(chǎn)品應(yīng)在5-15℃的環(huán)境溫度下密封儲(chǔ)存,有效期為產(chǎn)品發(fā)貨之日起1年。
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5
包裝方式/Packaging method:
標(biāo)準(zhǔn)包裝,
Standard package