產(chǎn)品規(guī)格書/Specification
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產(chǎn)品/product: |
導(dǎo)電銀漿/ Silver paste |
|
料號/Part number: |
01L-2608B |
適用范圍/Application:
單組分導(dǎo)體漿料系列，一種附著力可靠的用來固定芯片的導(dǎo)電銀漿。此漿料適合粘貼各類芯片到電路板、玻璃、陶瓷等基材，與基體的匹配性能良好，不流掛，用該漿料制出的電極固化后外觀光亮、細(xì)膩，結(jié)構(gòu)致密。
Single component conductor paste series, the paste is suitable for pasting various chips into the circuit board, glass, ceramic and other substrates, matching with the substrate is good.
使用條件/Operating conditions：
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基材 Substrate |
電路，玻璃，陶瓷，金屬 Thick film circuit, glass, ceramic, metal. |
|
使用方法 Method of use |
點膠，印刷 Dispensing ( by needle cylinder, etc.)，Printing |
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流平 Levelling |
5-10min minutes at room temperature 室溫下流平5-10分鐘（時間根據(jù)流平的實際情況決定）。 |
|
固化 Curing conditions |
通風(fēng)烘箱烘烤150~200℃，30分鐘 (固化溫度可以在150-200℃范圍內(nèi)，固化時間可根據(jù)實際情況決定) 150-200℃, 30 min ( It could be cured at a temperature between 130 ~ 180°C, but it depends of the thickness and the substrate.) |
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稀釋劑 Thinner |
ST-1001 |
性能/Characteristics：
1. 漿料性能/Paste Characteristics：
|
性能Characteristic |
標(biāo)準(zhǔn)Standard |
測試方法及條件 Test method and conditions |
|
|
1 |
Fineness |
≤15μm |
FOG test |
|
2 |
Viscosity |
80-280Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃，
Brookfield HBT（博利飛）粘度計， 轉(zhuǎn)子SC4-14/6R), 10rpm, 25±1℃ 粘度可根據(jù)用戶實際需要調(diào)節(jié)。 |
|
3 |
固體含量 Solid content |
70 |
銀 Silver |
2. 燒結(jié)后特性/Characteristics after curing：
在1燒結(jié)條件下，Check fired film produced under the conditions specified in 1）,
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特性 Characteristics |
Standard 標(biāo)準(zhǔn) |
測試方法和條件 Test method and conditions |
|
|
4 |
Resistivity 方阻 |
≤30mΩ/□ |
|
|
5 |
硬度 Hardness |
4H |
鉛筆硬度 Pencil hardness |
|
6 |
剪切強度 Shear strength |
12Mpa |
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保存條件，有效期/Storage condition and Term of validity
產(chǎn)品應(yīng)在5-15℃的環(huán)境溫度下密封儲存，有效期為產(chǎn)品發(fā)貨之日起六個月。
The product shall be guaranteed for 6 months after shipping date, keep tightly under at 5-15℃
包裝方式/Packaging method：
標(biāo)準(zhǔn)包裝，1000g/罐, 樣品可提供200克小罐包裝
Standard package 1000g/can，if you need sample to test, available 200g with small package.
